Textul licitației

;  The XUV Piezo Cluster will be used for the deposition of pure metals, metallic oxides and piezoelectric layers onto various substrates to be further processed using photolithography and deposition steps in the MESA+ Nanolab facilities. Brief description of the capabilities is outlined below:   The XUV Piezo Cluster shall be capable of processing at least 200 mm diameter substrates.   The XUV Piezo Cluster shall include a chamber for deposition of piezoelectric Pb(Zr,Ti)O3 (PZT) layer that acts as the active layer for sensor and actuator applications.   The XUV Piezo Cluster shall include a chamber or chambers for deposition of pure metals such as Pt, gold (Au) or conductive metal oxides such as LaNiO3 or SrRuO3 layers. The XUV Piezo Cluster shall have the capability to sputter the typically used Ti, Ta or Cr adhesion layers preceding the pure metal layers.  The XUV Piezo Cluster shall include a load-lock chamber for fast sample loading and reaching of the base pressure.   The XUV Piezo Cluster shall include a transfer chamber enabling the transfer of substrates between deposition chambers without breaking the vacuum.   The XUV Piezo Cluster shall be further expandible to include a pre-treatment chamber for purposes such as degassing or etching before or after the lay